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Geopolitical Watchlist & Sources

Geopolitical Watchlist

Live policy items tracked across this database, not tied to a single company.

  • ASML EUV export ban to China

    In force — full ban on EUV scanner exports to China, enforced by the Netherlands government aligned with US policy

    Who's Affected
    SMIC and all Chinese advanced-node ambitions
    Why It Matters
    The core structural chokepoint capping Chinese foundries at roughly 7nm-equivalent density via DUV multi-patterning workarounds, regardless of capital investment
  • High-NA EUV rollout (2026-2028)

    Intel took delivery of the first commercial unit (ASML TWINSCAN EXE:5200B) in Dec 2025; Samsung received its first unit in late 2025 and a second in 1H2026; mass production using these tools expected 2027-28 per ASML's CEO

    Who's Affected
    Intel, Samsung, SK Hynix confirmed as first adopters; TSMC has signaled it may wait until 2026-27 to integrate High-NA into A16
    Why It Matters
    The next lithography generation is, so far, distributed only to US-aligned players — extending rather than closing the gap with China
  • 2025 EDA export-control episode (Synopsys/Cadence/Siemens)

    BIS directed the three major EDA vendors to halt China sales in 2025, then partially reversed the directive

    Who's Affected
    Chinese fabless design houses and SMIC's advanced-node ambitions
    Why It Matters
    Confirmed that design software, not just fab tools, is now an active lever in US-China tech competition — a second potential chokepoint beyond lithography
  • CHIPS Act leading-edge fab funding status

    As of May 2026, all three major CHIPS-funded logic fabs are in volume production: TSMC Arizona Fab 21 Phase 1 (4nm, 24,000 wpm), Intel Ohio Module 1 (18A, 30,000 wpm), Samsung Taylor Fab 1 (3nm GAA, 15,000 wpm)

    Who's Affected
    TSMC, Intel, Samsung US operations
    Why It Matters
    US advanced-logic manufacturing share has risen from ~12% (2020) to ~22% (2026) per SIA estimates, though US-based wafer costs run 20-30% above equivalent Taiwan production
  • TSMC Nanjing VEU revocation

    Confirmed: Washington revoked VEU status for TSMC's Nanjing (16/12nm) fab effective Dec 31, 2025

    Who's Affected
    TSMC's Nanjing fab and its customers; equipment/software suppliers now need individual export licenses per shipment
    Why It Matters
    Adds a live continuity question for any 16/12nm-class demand routed through TSMC's China site — this node sits at the edge of the 'leading-edge' scope covered here
  • SMIC SMNC acquisition

    In process — SMIC acquiring Semiconductor Manufacturing North China (Beijing), adding two 300mm lines

    Who's Affected
    SMIC's domestic capacity base
    Why It Matters
    Domestic consolidation to grow capacity within existing export-controlled tool constraints, rather than through new leading-edge tool access
  • Rapidus as a deliberate Japan-US-Europe diversification project

    Ongoing — IBM technology transfer, imec Core Partner Program membership, NYCREATES/Albany collaboration, Japanese government backing exceeding ¥900B cited across funding rounds

    Who's Affected
    Rapidus; broader US/Japan/EU strategic-autonomy goals
    Why It Matters
    Explicitly designed to diversify leading-edge capability away from Taiwan/Korea concentration — a geopolitical hedge that remains commercially unproven

US Import Tariffs by Fab Country

Rates apply to imports into the United States from each country hosting a fab in this database. 0 of 12 countries have a rate recorded — the remainder are shown as not recorded rather than estimated.

Country of OriginTariff, Basis & Provenance
ChinaNot recorded
France (EU)Not recorded
Germany (EU)Not recorded
IndiaNot recorded
IsraelNot recorded
Italy (EU)Not recorded
JapanNot recorded
MalaysiaNot recorded
SingaporeNot recorded
South KoreaNot recorded
TaiwanNot recorded
United StatesNot recorded

Sources

Topic AreaSourceDate / Vintage
2025 full-year and Q4 foundry market share/revenue (TSMC, Samsung, SMIC, UMC, GF, Hua Hong, Tower, VIS, Nexchip, PSMC)Semiecosystem (Mark LaPedus) — "TSMC Extends Lead In Foundry Business"Mar 13, 2026
Q1 2026 foundry market share/revenue update; SMIC SMNC acquisitionSemiecosystem (Mark LaPedus) — "TSMC Gains Foundry Share in Q1 '26"Jun 12, 2026
TSMC/Samsung/SMIC revenue and share trend, full-year 2025 TSMC revenueThe Motley Fool — "Ranked: Global Semiconductor Manufacturers by Revenue"~Jun 2026
Foundry market sizing, node segment sharesFortune Business Insights — Semiconductor Foundry Market report2026
TSMC 2nm/3nm output expansion, Samsung 4nm/2nm positioning, sub-1nm roadmap delaySemiWiki — "TSMC Widens Gap with Samsung by Expanding 2nm and 3nm Output by 20%"May 1, 2026
Top-10 IC manufacturer rankings, 2nm race framingRichard Electronics — "Top 10 Integrated Circuits (IC) Manufacturers 2026"Dec 29, 2025
TSMC/Samsung/SMIC/Rapidus competitive framing, TSMC N2 sold out through Q2 2027Averroes.ai — "Top 10 Semiconductor Foundries [2026]"Jun 1, 2026
TSMC market-share rise 51%→64%/70%+, Samsung/Intel competitive narrativePatentPC — "Samsung vs. TSMC vs. Intel: Who's Winning the Foundry Market?"Jun 18, 2026
TSMC N2/Intel 18A/Samsung SF2 2nm-class comparison, Rapidus imec/IBM roadmapTom's Hardware — "Leading-edge foundry roadmaps for TSMC, Intel and Samsung"May 14, 2026
2nm node density/performance/yield/ecosystem comparison across TSMC/Samsung/Intel/Rapiduscyberraiden — "Comparing the Leading 2nm Nodes in 2026"Mar 11, 2026
ASML High-NA EUV adoption by Intel/Samsung/SK Hynix, timeline to 2027-28TrendForce — "ASML's High-NA EUV for 2027-28"Feb 16, 2026
Intel 18A yield (85%, improving 7-8%/month), TechInsights performance/density comparison vs. N2/SF2TechTimes — "Intel Foundry Hits 85% Yield, Winning Chip Orders as ASML Validates High NA EUV"~Jul 2026
Intel 14A High-NA EUV timing, Panther Lake dual-qualificationTom's Hardware — "Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV"~Jul 2026
Intel 14A High-NA EUV commitment, IFS Direct Connect announcementBits&Chips — "High-NA tee-off has been set: 2026"2026
Process-node architecture history (planar→FinFET→GAA), US-China export control bifurcation, EUV/DUV multipatterning capSemiconductorX — "Process Nodes: N3, N2, 18A, SF3; Foundry Concentration"2026
Rapidus IIM-1 fab roadmap, single-wafer manufacturing flow, 1.4nm plan, FY2025 financialsTom's Hardware — "Rapidus fab roadmap examined"~Jul 2026
CHIPS Act-funded logic fab volume-production status (TSMC AZ, Intel Ohio, Samsung Taylor), TSMC ESMC Dresden, JASM KumamotoSupplyICs — "CHIPS Act and Global Semiconductor Reshoring: A Mid-2026 Progress Report"May 12, 2026
Rapidus $1.7B funding round detail, IIM-1 site, NEDO backingVentureBurn — "Rapidus Raises $1.7B To Accelerate 2nm Semiconductor Production"Feb 28, 2026
Rapidus FY2026 government funding ($4B), IIM-1 opening date, Analysis CenterThe AI World — "Japan Backs Rapidus with $4B to Lead 2nm Chip Race"Apr 15, 2026
Rapidus $1.7B funding sourcing detail (IPA, corporate investors)The Register — "Rapidus lands $1.7B to chase 2nm chip production by 2027"Feb 27, 2026
Rapidus founding consortium, IBM/imec technology transfer, 2nm prototype timelineEnvisioning — "Rapidus 2nm Chip Manufacturing"2026
Rapidus history/roadmap detail, CoWoS reticle-stitching contextSemiVision/TSPA Semiconductor — "Rapidus: The Locomotive of Japan's Semiconductor Industry"Jul 19, 2025
CHIPS Act award figures (TSMC $6.6B, Intel $7.86B modified, Samsung $4.745B, Micron $6.165B)Consumer Electronics Daily — "CHIPS Act: 2B Semiconductor Investment & Fab Buildout 2026"May 13, 2026
TSMC fab list (Fab 1-4 8-inch, Fab 12/14/15/18/20/21/22, Nanjing, WaferTech, Shanghai)SemiWiki — "TSMC Launches Massive Expansion With 24 New Factories"Apr 27, 2025
TSMC fab detail incl. Nanjing/Kumamoto/8-inch fabsBlackridge Research — "A Complete List of TSMC Semiconductor Fabs and Location"May 6, 2026
TSMC global capacity/share (~65-70%), largest fabs ranking, Fab 12/14/15/18/20 node detailBlackridge Research — "List of Largest Semiconductor Fabs in the World (2026)"May 26, 2026
TSMC Nanjing Fab 16 VEU status revocation, effective Dec 31, 2025Notebookcheck — "TSMC's Nanjing fab to lose U.S. export license waiver by end of 2025"2025
TSMC Fab 16 Nanjing/Fab 12/21 capacity and node detailDiskmfr — "TSMC Global Fab Capacity and Process Node Overview"Sep 2, 2025
TSMC Kumamoto Fab 23 phase 1/2, Dresden ESMC node plan, 9-phases/year construction pace, multi-fab N2 rampTom's Hardware — "Analyzing TSMC's fab expansion roadmap"Jun 10, 2026
TSMC Nanjing/Shanghai/Kumamoto/SSMC overseas mature-vs-leading-edge role splitAminext — "TSMC's Global Footprint: Deep Dive into 2nm, A16 & Future Fabs"May 12, 2025
Leading-edge tape-out/mask/NRE cost figures ($10-20M+ mask at 3nm, $300-500M+ tape-out at 5nm)SemiconductorX — "Fabless Design & IP Cores Overview"2026
Wafer pricing by node ($3,000 at 28nm to $20,000+ at 3nm), Samsung 20-25% discount estimateSilicon Analysts — "Wafer Pricing by Process Node (2026)"Apr 2026
Manufacturing cost breakdown by node, mask/NRE escalation, CoWoS/HBM packaging add-onsSilicon Analysts — "Semiconductor Manufacturing Costs Explained"~Jul 2026
TSMC 3nm (N3/N3E) detailed cost breakdown, $15M mask set, yield by die sizeSilicon Analysts — "How Much Does a TSMC 3nm Chip Cost to Make? (2026 Guide)"Jun 22, 2026
MPW shuttle cost ranges, direct-engagement volume thresholds, foundry-engagement processSilicon Analysts — "Foundry Engagement Guide: From MPW Shuttle to Production"Jun 22, 2026
Fabless startup tapeout cost guide, CoWoS booking status (~1M wafers, NVIDIA ~60%), foundry-choice factorsSilicon Analysts — "How Much Does a Tapeout Cost? A Practical Guide for Fabless Startups"Mar 1, 2026
Wafer cost by node table ($3,000 at 28nm to ~$30,000 at 2nm), mask cost >$30M at 3nm, NRE amortization modelLegitLads — "Wafer Cost Calculator"May 2, 2026
General manufacturing cost breakdown framing (wafer/mask/NRE at leading edge)AnySilicon — "Semiconductor Manufacturing Cost Breakdown"May 22, 2026