Geopolitical Watchlist & Sources
Geopolitical Watchlist
Live policy items tracked across this database, not tied to a single company.
ASML EUV export ban to China
In force — full ban on EUV scanner exports to China, enforced by the Netherlands government aligned with US policy
- Who's Affected
- SMIC and all Chinese advanced-node ambitions
- Why It Matters
- The core structural chokepoint capping Chinese foundries at roughly 7nm-equivalent density via DUV multi-patterning workarounds, regardless of capital investment
High-NA EUV rollout (2026-2028)
Intel took delivery of the first commercial unit (ASML TWINSCAN EXE:5200B) in Dec 2025; Samsung received its first unit in late 2025 and a second in 1H2026; mass production using these tools expected 2027-28 per ASML's CEO
- Who's Affected
- Intel, Samsung, SK Hynix confirmed as first adopters; TSMC has signaled it may wait until 2026-27 to integrate High-NA into A16
- Why It Matters
- The next lithography generation is, so far, distributed only to US-aligned players — extending rather than closing the gap with China
2025 EDA export-control episode (Synopsys/Cadence/Siemens)
BIS directed the three major EDA vendors to halt China sales in 2025, then partially reversed the directive
- Who's Affected
- Chinese fabless design houses and SMIC's advanced-node ambitions
- Why It Matters
- Confirmed that design software, not just fab tools, is now an active lever in US-China tech competition — a second potential chokepoint beyond lithography
CHIPS Act leading-edge fab funding status
As of May 2026, all three major CHIPS-funded logic fabs are in volume production: TSMC Arizona Fab 21 Phase 1 (4nm, 24,000 wpm), Intel Ohio Module 1 (18A, 30,000 wpm), Samsung Taylor Fab 1 (3nm GAA, 15,000 wpm)
- Who's Affected
- TSMC, Intel, Samsung US operations
- Why It Matters
- US advanced-logic manufacturing share has risen from ~12% (2020) to ~22% (2026) per SIA estimates, though US-based wafer costs run 20-30% above equivalent Taiwan production
TSMC Nanjing VEU revocation
Confirmed: Washington revoked VEU status for TSMC's Nanjing (16/12nm) fab effective Dec 31, 2025
- Who's Affected
- TSMC's Nanjing fab and its customers; equipment/software suppliers now need individual export licenses per shipment
- Why It Matters
- Adds a live continuity question for any 16/12nm-class demand routed through TSMC's China site — this node sits at the edge of the 'leading-edge' scope covered here
SMIC SMNC acquisition
In process — SMIC acquiring Semiconductor Manufacturing North China (Beijing), adding two 300mm lines
- Who's Affected
- SMIC's domestic capacity base
- Why It Matters
- Domestic consolidation to grow capacity within existing export-controlled tool constraints, rather than through new leading-edge tool access
Rapidus as a deliberate Japan-US-Europe diversification project
Ongoing — IBM technology transfer, imec Core Partner Program membership, NYCREATES/Albany collaboration, Japanese government backing exceeding ¥900B cited across funding rounds
- Who's Affected
- Rapidus; broader US/Japan/EU strategic-autonomy goals
- Why It Matters
- Explicitly designed to diversify leading-edge capability away from Taiwan/Korea concentration — a geopolitical hedge that remains commercially unproven
US Import Tariffs by Fab Country
Rates apply to imports into the United States from each country hosting a fab in this database. 0 of 12 countries have a rate recorded — the remainder are shown as not recorded rather than estimated.
| Country of Origin | Tariff, Basis & Provenance |
|---|---|
| China | Not recorded |
| France (EU) | Not recorded |
| Germany (EU) | Not recorded |
| India | Not recorded |
| Israel | Not recorded |
| Italy (EU) | Not recorded |
| Japan | Not recorded |
| Malaysia | Not recorded |
| Singapore | Not recorded |
| South Korea | Not recorded |
| Taiwan | Not recorded |
| United States | Not recorded |
Sources
| Topic Area | Source | Date / Vintage |
|---|---|---|
| 2025 full-year and Q4 foundry market share/revenue (TSMC, Samsung, SMIC, UMC, GF, Hua Hong, Tower, VIS, Nexchip, PSMC) | Semiecosystem (Mark LaPedus) — "TSMC Extends Lead In Foundry Business" | Mar 13, 2026 |
| Q1 2026 foundry market share/revenue update; SMIC SMNC acquisition | Semiecosystem (Mark LaPedus) — "TSMC Gains Foundry Share in Q1 '26" | Jun 12, 2026 |
| TSMC/Samsung/SMIC revenue and share trend, full-year 2025 TSMC revenue | The Motley Fool — "Ranked: Global Semiconductor Manufacturers by Revenue" | ~Jun 2026 |
| Foundry market sizing, node segment shares | Fortune Business Insights — Semiconductor Foundry Market report | 2026 |
| TSMC 2nm/3nm output expansion, Samsung 4nm/2nm positioning, sub-1nm roadmap delay | SemiWiki — "TSMC Widens Gap with Samsung by Expanding 2nm and 3nm Output by 20%" | May 1, 2026 |
| Top-10 IC manufacturer rankings, 2nm race framing | Richard Electronics — "Top 10 Integrated Circuits (IC) Manufacturers 2026" | Dec 29, 2025 |
| TSMC/Samsung/SMIC/Rapidus competitive framing, TSMC N2 sold out through Q2 2027 | Averroes.ai — "Top 10 Semiconductor Foundries [2026]" | Jun 1, 2026 |
| TSMC market-share rise 51%→64%/70%+, Samsung/Intel competitive narrative | PatentPC — "Samsung vs. TSMC vs. Intel: Who's Winning the Foundry Market?" | Jun 18, 2026 |
| TSMC N2/Intel 18A/Samsung SF2 2nm-class comparison, Rapidus imec/IBM roadmap | Tom's Hardware — "Leading-edge foundry roadmaps for TSMC, Intel and Samsung" | May 14, 2026 |
| 2nm node density/performance/yield/ecosystem comparison across TSMC/Samsung/Intel/Rapidus | cyberraiden — "Comparing the Leading 2nm Nodes in 2026" | Mar 11, 2026 |
| ASML High-NA EUV adoption by Intel/Samsung/SK Hynix, timeline to 2027-28 | TrendForce — "ASML's High-NA EUV for 2027-28" | Feb 16, 2026 |
| Intel 18A yield (85%, improving 7-8%/month), TechInsights performance/density comparison vs. N2/SF2 | TechTimes — "Intel Foundry Hits 85% Yield, Winning Chip Orders as ASML Validates High NA EUV" | ~Jul 2026 |
| Intel 14A High-NA EUV timing, Panther Lake dual-qualification | Tom's Hardware — "Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV" | ~Jul 2026 |
| Intel 14A High-NA EUV commitment, IFS Direct Connect announcement | Bits&Chips — "High-NA tee-off has been set: 2026" | 2026 |
| Process-node architecture history (planar→FinFET→GAA), US-China export control bifurcation, EUV/DUV multipatterning cap | SemiconductorX — "Process Nodes: N3, N2, 18A, SF3; Foundry Concentration" | 2026 |
| Rapidus IIM-1 fab roadmap, single-wafer manufacturing flow, 1.4nm plan, FY2025 financials | Tom's Hardware — "Rapidus fab roadmap examined" | ~Jul 2026 |
| CHIPS Act-funded logic fab volume-production status (TSMC AZ, Intel Ohio, Samsung Taylor), TSMC ESMC Dresden, JASM Kumamoto | SupplyICs — "CHIPS Act and Global Semiconductor Reshoring: A Mid-2026 Progress Report" | May 12, 2026 |
| Rapidus $1.7B funding round detail, IIM-1 site, NEDO backing | VentureBurn — "Rapidus Raises $1.7B To Accelerate 2nm Semiconductor Production" | Feb 28, 2026 |
| Rapidus FY2026 government funding ($4B), IIM-1 opening date, Analysis Center | The AI World — "Japan Backs Rapidus with $4B to Lead 2nm Chip Race" | Apr 15, 2026 |
| Rapidus $1.7B funding sourcing detail (IPA, corporate investors) | The Register — "Rapidus lands $1.7B to chase 2nm chip production by 2027" | Feb 27, 2026 |
| Rapidus founding consortium, IBM/imec technology transfer, 2nm prototype timeline | Envisioning — "Rapidus 2nm Chip Manufacturing" | 2026 |
| Rapidus history/roadmap detail, CoWoS reticle-stitching context | SemiVision/TSPA Semiconductor — "Rapidus: The Locomotive of Japan's Semiconductor Industry" | Jul 19, 2025 |
| CHIPS Act award figures (TSMC $6.6B, Intel $7.86B modified, Samsung $4.745B, Micron $6.165B) | Consumer Electronics Daily — "CHIPS Act: 2B Semiconductor Investment & Fab Buildout 2026" | May 13, 2026 |
| TSMC fab list (Fab 1-4 8-inch, Fab 12/14/15/18/20/21/22, Nanjing, WaferTech, Shanghai) | SemiWiki — "TSMC Launches Massive Expansion With 24 New Factories" | Apr 27, 2025 |
| TSMC fab detail incl. Nanjing/Kumamoto/8-inch fabs | Blackridge Research — "A Complete List of TSMC Semiconductor Fabs and Location" | May 6, 2026 |
| TSMC global capacity/share (~65-70%), largest fabs ranking, Fab 12/14/15/18/20 node detail | Blackridge Research — "List of Largest Semiconductor Fabs in the World (2026)" | May 26, 2026 |
| TSMC Nanjing Fab 16 VEU status revocation, effective Dec 31, 2025 | Notebookcheck — "TSMC's Nanjing fab to lose U.S. export license waiver by end of 2025" | 2025 |
| TSMC Fab 16 Nanjing/Fab 12/21 capacity and node detail | Diskmfr — "TSMC Global Fab Capacity and Process Node Overview" | Sep 2, 2025 |
| TSMC Kumamoto Fab 23 phase 1/2, Dresden ESMC node plan, 9-phases/year construction pace, multi-fab N2 ramp | Tom's Hardware — "Analyzing TSMC's fab expansion roadmap" | Jun 10, 2026 |
| TSMC Nanjing/Shanghai/Kumamoto/SSMC overseas mature-vs-leading-edge role split | Aminext — "TSMC's Global Footprint: Deep Dive into 2nm, A16 & Future Fabs" | May 12, 2025 |
| Leading-edge tape-out/mask/NRE cost figures ($10-20M+ mask at 3nm, $300-500M+ tape-out at 5nm) | SemiconductorX — "Fabless Design & IP Cores Overview" | 2026 |
| Wafer pricing by node ($3,000 at 28nm to $20,000+ at 3nm), Samsung 20-25% discount estimate | Silicon Analysts — "Wafer Pricing by Process Node (2026)" | Apr 2026 |
| Manufacturing cost breakdown by node, mask/NRE escalation, CoWoS/HBM packaging add-ons | Silicon Analysts — "Semiconductor Manufacturing Costs Explained" | ~Jul 2026 |
| TSMC 3nm (N3/N3E) detailed cost breakdown, $15M mask set, yield by die size | Silicon Analysts — "How Much Does a TSMC 3nm Chip Cost to Make? (2026 Guide)" | Jun 22, 2026 |
| MPW shuttle cost ranges, direct-engagement volume thresholds, foundry-engagement process | Silicon Analysts — "Foundry Engagement Guide: From MPW Shuttle to Production" | Jun 22, 2026 |
| Fabless startup tapeout cost guide, CoWoS booking status (~1M wafers, NVIDIA ~60%), foundry-choice factors | Silicon Analysts — "How Much Does a Tapeout Cost? A Practical Guide for Fabless Startups" | Mar 1, 2026 |
| Wafer cost by node table ($3,000 at 28nm to ~$30,000 at 2nm), mask cost >$30M at 3nm, NRE amortization model | LegitLads — "Wafer Cost Calculator" | May 2, 2026 |
| General manufacturing cost breakdown framing (wafer/mask/NRE at leading edge) | AnySilicon — "Semiconductor Manufacturing Cost Breakdown" | May 22, 2026 |
