Find assembly and test sites by capability. Results are facilities. A facility matches when the capability is recorded against the site or against its parent company — the two are tracked separately, and requiring a site-level record would hide companies whose facility-level research is still incomplete.
Packaging family is a grouping (Wire Bond, Wafer-Level Packaging, 2.5D…) and matches anything in its subtree; technology is a specific process (FOWLP, hybrid bonding…). The shortcuts are derived from the taxonomies — Automotive matches an automotive end market or an IATF 16949 / AEC-Q certification. Production status narrows which capability records count as evidence; certifications are judged on validity dates instead, so it does not apply to them.
No facilities match these filters
No facilities have been recorded.
