Hua Hong Semiconductor

Shanghai, China

Company Overview

Headquarters: Shanghai, China
Ownership: Public (HKEX/SSE: 1347/688347); Hua Hong Group, state-linked
Total Fabs: Fabs 1-3 (Shanghai, 200mm) + Fab 7 and Fab 9 (Wuxi, 300mm). HLMC Fab 5/6 acquisition announced Aug 2025, not yet closed as of mid-2026
200mm Fab Locations: Hua Hong Grace Fabs 1-3, Shanghai
Wafer Sizes Run: 200mm & 300mm
Most Recent Revenue: FY2025 revenue US$2,402.1M (+19.9% YoY); Q4 2025 US$659.9M (record, +22.4% YoY)
Employees: ~7,628 as of Dec 31, 2025 (up from 7,487 at end-2024)
Major Segments: Power discretes/IGBT, MCU, analog & power management, CIS
Long-Term Strategy: Power/analog specialty leadership within China; 96-109% utilization and 2025-26 price increases reported

No named process technologies recorded for this foundry yet.

Absence here means the process list has not been researched, not that the foundry offers none.

CMOS Min/Max Geometry: 40nm-350nm (Wuxi 300mm fabs run down to 65/55/40nm; 90nm is the advanced node for the 8-inch embedded-NVM platform specifically)
CMOS Analog/RF/Mixed-Signal: Limited RF
CMOS Embedded Memory: Yes
CMOS HV, Automotive-Qualified: Yes
BCD Voltage Range: Yes (strong)
BCD LDMOS: Yes
BCD/SOI Isolation Option: Limited
SOI — PD-SOI: No
SOI — FD-SOI: No
SOI — RF-SOI: Limited
SOI — Photonics-Compatible: No
MEMS: Limited
Power — SiC: Yes (SiC/IGBT)
Power — GaN: No
Power — HV CMOS: Yes
Specialty — eNVM: Yes
Specialty — CIS: Yes
Specialty — Photonics: No
Specialty — Display Driver: Yes

Qualified 200mm Fabs: 3 (Shanghai) + Fab 9 (Wuxi)
Multi-Site Technology Transfer: Yes, internally
Automotive Production Volume: Growing, primarily domestic China
IATF 16949: Verify
ISO 13485 (Medical): Verify
ISO 9001: Yes
AS9100 (Aerospace): No
Defense / Rad-Hard Experience: None disclosed
Export Restriction Status: Not on Entity List; scrutinized under 2025-26 Section 301 legacy-chip investigation/tariff timeline

Typical Quoted Lead Time (200mm): Verify — reported tight
Recent Utilization: 96-109%
Expansion Plans: Fab 9 Wuxi (300mm) ramp continuing; part of broader China mature-node build-out
Geographic Redundancy: Limited — concentrated in China (Shanghai, Wuxi)
Single-Site Concentration Risk: High — same single-jurisdiction concentration as SMIC
Natural Disaster Exposure: Low-moderate
Utility Risk (Power/Water): Moderate

Fab Site	Country	US Import Tariff	Considerations	Risk
Fabs 1-3 — Shanghai	China	Not recorded	Not on Entity List but scrutinized under 2025-26 Section 301 legacy-chip investigation	High
Fab 9 — Wuxi	China	Not recorded	Same Section 301 tariff-timeline exposure as legacy fabs	High

MPW Shuttle Availability: Limited; primarily volume-production oriented
Typical Mask Set Cost (Order of Magnitude): Mature node, competitive vs. Taiwanese peers
Prototype/Engineering Wafer Pricing: Not publicly listed
Production Wafer Pricing Direction (2025–26): Price increases announced amid 96-109% utilization
Typical NRE Posture: Volume-oriented
Packaging/Test Partnerships: Primarily domestic Chinese OSAT partners
Licensing / IP Fees: Standard PDK/TLA licensing