← 200mm Mature-Node
onsemi
Scottsdale, AZ, USA
Company Overview
- Headquarters
- Scottsdale, AZ, USA
- Ownership
- Public (Nasdaq: ON); IDM
- Total Fabs
- Front-end sites per FY2025 10-K: East Fishkill NY (300mm), Gresham OR (200mm), Roznov pod Radhostem CZ, Seremban MY, Bucheon KR, Mountain Top PA, Aizuwakamatsu JP, Nampa ID, Hudson NH (SiC boules). Portfolio is in flux — Tarlac PH and Mountain Top PA were agreed for divestiture in July 2026, and 2024-26 restructuring programs have cut several thousand roles
- 200mm Fab Locations
- Gresham OR (200mm); Bucheon KR (200mm SiC, ramped 2026). Note: Pocatello ID was divested in 2022 and East Fishkill NY is 300mm
- Wafer Sizes Run
- 150mm & 200mm (SiC line transitioning 150→200mm)
- Most Recent Revenue
- FY2025 revenue US$5,995.4M (down from US$7,082.3M FY2024 and US$8,253.0M FY2023); Q1 2026 US$1,513.3M
- Employees
- ~22,600 regular full-time as of Dec 31, 2025, across 33 countries (~15% US-based)
- Major Segments
- Power/SiC for EV & industrial, image sensing, intelligent sensing
- Long-Term Strategy
- Primarily captive IDM capacity; sells external foundry/IP access selectively; leading SiC vertical integration
Process Technologies
No named process technologies recorded for this foundry yet.
Absence here means the process list has not been researched, not that the foundry offers none.
Technology Portfolio
- CMOS Min/Max Geometry
- IDM legacy nodes
- CMOS Analog/RF/Mixed-Signal
- Limited (captive)
- CMOS Embedded Memory
- Limited
- CMOS HV, Automotive-Qualified
- Yes
- BCD Voltage Range
- Yes
- BCD LDMOS
- Yes
- BCD/SOI Isolation Option
- Limited
- SOI — PD-SOI
- No
- SOI — FD-SOI
- No
- SOI — RF-SOI
- No
- SOI — Photonics-Compatible
- Limited
- MEMS
- No
- Power — SiC
- Yes (leading, 150→200mm)
- Power — GaN
- No
- Power — HV CMOS
- Yes
- Specialty — eNVM
- Limited
- Specialty — CIS
- No
- Specialty — Photonics
- Limited
- Specialty — Display Driver
- No
Manufacturing Capability
- Qualified 200mm Fabs
- Multiple US fabs (mixed 150/200mm)
- Multi-Site Technology Transfer
- Yes, internal IDM transfer
- Automotive Production Volume
- Yes — major automotive/EV supplier
- IATF 16949
- Yes — automotive-facing sites certified
- ISO 13485 (Medical)
- Verify
- ISO 9001
- Yes
- AS9100 (Aerospace)
- Limited — verify
- Defense / Rad-Hard Experience
- Some — US defense-adjacent supply reported
- Export Restriction Status
- Not export-restricted; benefits from US reshoring incentives
Capacity & Supply Chain
- Typical Quoted Lead Time (200mm)
- Verify
- Recent Utilization
- Verify
- Expansion Plans
- SiC line transition from 150mm to 200mm wafers ongoing
- Geographic Redundancy
- Good — multiple US sites
- Single-Site Concentration Risk
- Low — US-diversified
- Natural Disaster Exposure
- Low (US sites generally low seismic risk; verify hurricane/wildfire exposure by site)
- Utility Risk (Power/Water)
- Low-moderate — Western US drought has raised water-cost questions before
Fabs & Geopolitical Risk
| Fab Site | Country | US Import Tariff | Considerations | Risk |
|---|---|---|---|---|
| East Fishkill NY (300mm) / Gresham OR (200mm) / Bucheon KR / Roznov CZ / Nampa ID / Hudson NH | United States | Not recorded | Benefits from EV/automotive reshoring incentives | Low |
Cost & Commercial
- MPW Shuttle Availability
- Limited — primarily captive IDM capacity, external access is selective
- Typical Mask Set Cost (Order of Magnitude)
- N/A (IDM) — verify for any external foundry program
- Prototype/Engineering Wafer Pricing
- Not applicable / not publicly listed
- Production Wafer Pricing Direction (2025–26)
- N/A — internal cost structure not disclosed
- Typical NRE Posture
- Selective; onsemi prioritizes its own product roadmap over external foundry customers
- Packaging/Test Partnerships
- Internal + limited external OSAT relationships
- Licensing / IP Fees
- IP licensing selective, primarily around SiC
Ecosystem
- Cadence
- Yes (internal use)
- Synopsys
- Yes (internal use)
- Siemens EDA (Calibre)
- Yes (internal use)
- Notable IP Vendor Relationships
- Primarily internal/captive IP
- OSAT / Packaging Partners
- Internal + limited external OSAT
- Design-Service Partners
- Limited external design-service engagement
- University / Reference-Design Programs
- Limited
- Open-Source / Academic PDK
- No public open PDK
