HSGFoundry Specialists
← 200mm Mature-Node

onsemi

Scottsdale, AZ, USA

Company Overview

Headquarters
Scottsdale, AZ, USA
Ownership
Public (Nasdaq: ON); IDM
Total Fabs
Front-end sites per FY2025 10-K: East Fishkill NY (300mm), Gresham OR (200mm), Roznov pod Radhostem CZ, Seremban MY, Bucheon KR, Mountain Top PA, Aizuwakamatsu JP, Nampa ID, Hudson NH (SiC boules). Portfolio is in flux — Tarlac PH and Mountain Top PA were agreed for divestiture in July 2026, and 2024-26 restructuring programs have cut several thousand roles
200mm Fab Locations
Gresham OR (200mm); Bucheon KR (200mm SiC, ramped 2026). Note: Pocatello ID was divested in 2022 and East Fishkill NY is 300mm
Wafer Sizes Run
150mm & 200mm (SiC line transitioning 150→200mm)
Most Recent Revenue
FY2025 revenue US$5,995.4M (down from US$7,082.3M FY2024 and US$8,253.0M FY2023); Q1 2026 US$1,513.3M
Employees
~22,600 regular full-time as of Dec 31, 2025, across 33 countries (~15% US-based)
Major Segments
Power/SiC for EV & industrial, image sensing, intelligent sensing
Long-Term Strategy
Primarily captive IDM capacity; sells external foundry/IP access selectively; leading SiC vertical integration

Process Technologies

No named process technologies recorded for this foundry yet.

Absence here means the process list has not been researched, not that the foundry offers none.

Technology Portfolio

CMOS Min/Max Geometry
IDM legacy nodes
CMOS Analog/RF/Mixed-Signal
Limited (captive)
CMOS Embedded Memory
Limited
CMOS HV, Automotive-Qualified
Yes
BCD Voltage Range
Yes
BCD LDMOS
Yes
BCD/SOI Isolation Option
Limited
SOI — PD-SOI
No
SOI — FD-SOI
No
SOI — RF-SOI
No
SOI — Photonics-Compatible
Limited
MEMS
No
Power — SiC
Yes (leading, 150→200mm)
Power — GaN
No
Power — HV CMOS
Yes
Specialty — eNVM
Limited
Specialty — CIS
No
Specialty — Photonics
Limited
Specialty — Display Driver
No

Manufacturing Capability

Qualified 200mm Fabs
Multiple US fabs (mixed 150/200mm)
Multi-Site Technology Transfer
Yes, internal IDM transfer
Automotive Production Volume
Yes — major automotive/EV supplier
IATF 16949
Yes — automotive-facing sites certified
ISO 13485 (Medical)
Verify
ISO 9001
Yes
AS9100 (Aerospace)
Limited — verify
Defense / Rad-Hard Experience
Some — US defense-adjacent supply reported
Export Restriction Status
Not export-restricted; benefits from US reshoring incentives

Capacity & Supply Chain

Typical Quoted Lead Time (200mm)
Verify
Recent Utilization
Verify
Expansion Plans
SiC line transition from 150mm to 200mm wafers ongoing
Geographic Redundancy
Good — multiple US sites
Single-Site Concentration Risk
Low — US-diversified
Natural Disaster Exposure
Low (US sites generally low seismic risk; verify hurricane/wildfire exposure by site)
Utility Risk (Power/Water)
Low-moderate — Western US drought has raised water-cost questions before

Fabs & Geopolitical Risk

Fab SiteCountryUS Import TariffConsiderationsRisk
East Fishkill NY (300mm) / Gresham OR (200mm) / Bucheon KR / Roznov CZ / Nampa ID / Hudson NHUnited StatesNot recordedBenefits from EV/automotive reshoring incentivesLow

Cost & Commercial

MPW Shuttle Availability
Limited — primarily captive IDM capacity, external access is selective
Typical Mask Set Cost (Order of Magnitude)
N/A (IDM) — verify for any external foundry program
Prototype/Engineering Wafer Pricing
Not applicable / not publicly listed
Production Wafer Pricing Direction (2025–26)
N/A — internal cost structure not disclosed
Typical NRE Posture
Selective; onsemi prioritizes its own product roadmap over external foundry customers
Packaging/Test Partnerships
Internal + limited external OSAT relationships
Licensing / IP Fees
IP licensing selective, primarily around SiC

Ecosystem

Cadence
Yes (internal use)
Synopsys
Yes (internal use)
Siemens EDA (Calibre)
Yes (internal use)
Notable IP Vendor Relationships
Primarily internal/captive IP
OSAT / Packaging Partners
Internal + limited external OSAT
Design-Service Partners
Limited external design-service engagement
University / Reference-Design Programs
Limited
Open-Source / Academic PDK
No public open PDK