← 200mm Mature-Node
Powerchip / PSMC
Hsinchu, Taiwan
Company Overview
- Headquarters
- Hsinchu, Taiwan
- Ownership
- Public (TWSE: 6770)
- Total Fabs
- Multiple fabs in Taiwan; new JV fab in Dholera, India (under construction)
- 200mm Fab Locations
- Hsinchu/Tainan 200mm & 300mm lines
- Wafer Sizes Run
- 200mm & 300mm
- Most Recent Revenue
- FY2025 consolidated revenue NT$46.73B (~US$1.4-1.5B); Q2 2026 NT$17.29B
- Employees
- ~8,100 per PSMC company profile
- Major Segments
- Power management, display driver, DRAM-heritage logic, GaN
- Long-Term Strategy
- Diversifying geographically via India JV with Tata Electronics; picking up GaN foundry business TSMC is exiting
Process Technologies
No named process technologies recorded for this foundry yet.
Absence here means the process list has not been researched, not that the foundry offers none.
Technology Portfolio
- CMOS Min/Max Geometry
- DRAM-heritage logic, mature nodes
- CMOS Analog/RF/Mixed-Signal
- Limited
- CMOS Embedded Memory
- Yes (DRAM heritage)
- CMOS HV, Automotive-Qualified
- Yes
- BCD Voltage Range
- Yes
- BCD LDMOS
- Yes
- BCD/SOI Isolation Option
- Limited
- SOI — PD-SOI
- No
- SOI — FD-SOI
- No
- SOI — RF-SOI
- Limited
- SOI — Photonics-Compatible
- No
- MEMS
- No
- Power — SiC
- No
- Power — GaN
- Yes (from TSMC exit)
- Power — HV CMOS
- Yes
- Specialty — eNVM
- Yes
- Specialty — CIS
- Yes
- Specialty — Photonics
- No
- Specialty — Display Driver
- Yes
Manufacturing Capability
- Qualified 200mm Fabs
- Multiple Taiwan fabs + Dholera (India, building)
- Multi-Site Technology Transfer
- Yes, internally
- Automotive Production Volume
- Growing
- IATF 16949
- Verify
- ISO 13485 (Medical)
- Verify
- ISO 9001
- Yes
- AS9100 (Aerospace)
- No
- Defense / Rad-Hard Experience
- None disclosed
- Export Restriction Status
- Not export-restricted; India JV eligible for Indian government incentives
Capacity & Supply Chain
- Typical Quoted Lead Time (200mm)
- Verify
- Recent Utilization
- Verify
- Expansion Plans
- Dholera, India JV fab (Tata Electronics) targeted ~2027, ~50,000 WSPM planned
- Geographic Redundancy
- Improving — adding India to Taiwan base
- Single-Site Concentration Risk
- Moderate — still majority Taiwan-based today
- Natural Disaster Exposure
- Elevated (Taiwan) / to-be-determined (India, new site)
- Utility Risk (Power/Water)
- Moderate (Taiwan) / TBD (India)
Fabs & Geopolitical Risk
| Fab Site | Country | US Import Tariff | Considerations | Risk |
|---|---|---|---|---|
| Hsinchu, Tainan | Taiwan | Not recorded | Taiwan Strait risk; pursuing geographic diversification via India JV | Elevated |
Cost & Commercial
- MPW Shuttle Availability
- Limited
- Typical Mask Set Cost (Order of Magnitude)
- Mature node: low-to-mid six figures
- Prototype/Engineering Wafer Pricing
- Not publicly listed
- Production Wafer Pricing Direction (2025–26)
- Verify — GaN business gaining share as TSMC exits
- Typical NRE Posture
- Volume-oriented
- Packaging/Test Partnerships
- Taiwanese OSAT partners
- Licensing / IP Fees
- Standard PDK/TLA licensing
Ecosystem
- Cadence
- Yes
- Synopsys
- Yes
- Siemens EDA (Calibre)
- Yes
- Notable IP Vendor Relationships
- Verify current list
- OSAT / Packaging Partners
- Taiwanese OSAT partners
- Design-Service Partners
- Regional design-service houses
- University / Reference-Design Programs
- Limited public academic program
- Open-Source / Academic PDK
- No public open PDK