SMIC

Shanghai, China

Company Overview

Headquarters: Shanghai, China
Ownership: Public (HKEX/SSE: 0981/688981); state-linked strategic shareholders
Total Fabs: Multiple fabs across Shanghai, Beijing, Tianjin, Shenzhen
200mm Fab Locations: Shanghai and Tianjin 200mm lines
Wafer Sizes Run: 200mm & 300mm
Most Recent Revenue: FY2025 record revenue ~US$9.327B (+16.2% YoY); Q1 2026 ~US$2.505B
Employees: 25,941 per FY2025 annual report (25,964 in FY2024)
Major Segments: Consumer electronics, communications, computer, industrial/automotive
Long-Term Strategy: China's flagship foundry; national self-sufficiency mandate; pushing toward 7nm-class via DUV multi-patterning under US export-control constraints

No named process technologies recorded for this foundry yet.

Absence here means the process list has not been researched, not that the foundry offers none.

Qualified 200mm Fabs: Multiple (Shanghai, Tianjin)
Multi-Site Technology Transfer: Yes, internally
Automotive Production Volume: Growing, primarily domestic China
IATF 16949: Verify
ISO 13485 (Medical): Verify
ISO 9001: Yes
AS9100 (Aerospace): No
Defense / Rad-Hard Experience: None disclosed
Export Restriction Status: On US BIS Entity List; subject to advanced-lithography and node-agnostic export controls

Typical Quoted Lead Time (200mm): Verify — reported as tight amid high utilization
Recent Utilization: ~80%+, some lines 96-109% (sister China foundries)
Expansion Plans: Guided +40,000 12-inch-equiv wafers/month by end-2026, ~18%/yr capacity growth
Geographic Redundancy: Limited — concentrated in China (Shanghai, Tianjin, Beijing, Shenzhen)
Single-Site Concentration Risk: High — all capacity within one jurisdiction under active export-control pressure
Natural Disaster Exposure: Low-moderate seismic risk in most China fab locations
Utility Risk (Power/Water): Moderate — regional grid/water constraints vary by city

Fab Site	Country	US Import Tariff	Considerations	Risk
SMIC Shanghai	China	Not recorded	On US Entity List; BIS export controls restrict advanced lithography/node-agnostic tool access	Severe
SMIC Tianjin	China	Not recorded	Same Entity List exposure as Shanghai; serves domestic Chinese demand	Severe

MPW Shuttle Availability: Limited for non-Chinese customers; primarily volume-production oriented
Typical Mask Set Cost (Order of Magnitude): Mature node: reported to undercut Taiwanese pricing
Prototype/Engineering Wafer Pricing: Not publicly listed
Production Wafer Pricing Direction (2025–26): Price increases announced for 2026 amid tight supply; also cited offering wafers 20-40% below Taiwanese peers on some nodes/quantities (two-tier dynamic)
Typical NRE Posture: Volume-oriented; smaller/startup programs less common
Packaging/Test Partnerships: Primarily domestic Chinese OSAT partners (JCET and others)
Licensing / IP Fees: Standard PDK/TLA licensing, subject to export-control compliance review by Western EDA vendors

Cadence: Yes, where export-control compliant
Synopsys: Yes, where export-control compliant
Siemens EDA (Calibre): Yes, where export-control compliant
Notable IP Vendor Relationships: Primarily domestic Chinese IP vendors plus licensed international IP where compliant
OSAT / Packaging Partners: Primarily domestic Chinese OSAT (JCET and others)
Design-Service Partners: Domestic Chinese design-service ecosystem
University / Reference-Design Programs: Limited
Open-Source / Academic PDK: No public open PDK