UMC

Hsinchu, Taiwan

Company Overview

Headquarters: Hsinchu, Taiwan
Ownership: Public (TWSE/NYSE: UMC)
Total Fabs: 12 fabs across Taiwan, Singapore, China, Japan, US(design)
200mm Fab Locations: Fab 8A/8C/8D/8E/8F/8S (all Hsinchu, 110nm-3um) and Fab 8N / Hejian (Suzhou, China, 110-500nm); plus Wavetek (Hsinchu, 150mm). Singapore Fab 12i and Tainan Fab 12A are 300mm-only
Wafer Sizes Run: 200mm & 300mm
Most Recent Revenue: FY2025 revenue NT$237.55B (~US$7.5B), UMC's second-best year; FY2024 NT$232.3B. Q2 2026 NT$68.73B (~US$2.18B, +17.0% YoY), utilization 85%
Employees: 19,097 as of Dec 31, 2025
Major Segments: Communications (42% of revenue), consumer electronics (29%), computer, others
Long-Term Strategy: Exited below 20nm; doubling down on 22/28nm and specialty 200mm (RF, power) plus new silicon photonics via imec license

No named process technologies recorded for this foundry yet.

Absence here means the process list has not been researched, not that the foundry offers none.

CMOS Min/Max Geometry: 14nm-3um (Fab 8A reaches 3um; Wavetek 150mm to 5um). 12nm in development with Intel at its Arizona site, mass production targeted 2027
CMOS Analog/RF/Mixed-Signal: Yes
CMOS Embedded Memory: Yes
CMOS HV, Automotive-Qualified: Yes
BCD Voltage Range: Yes
BCD LDMOS: Yes
BCD/SOI Isolation Option: Limited
SOI — PD-SOI: Limited
SOI — FD-SOI: No
SOI — RF-SOI: Yes
SOI — Photonics-Compatible: Emerging (imec iSiPP300 license)
MEMS: Limited
Power — SiC: No
Power — GaN: Limited
Power — HV CMOS: Yes
Specialty — eNVM: Yes
Specialty — CIS: Limited
Specialty — Photonics: Emerging
Specialty — Display Driver: Limited

Qualified 200mm Fabs: Multiple (Taiwan, Singapore, China)
Multi-Site Technology Transfer: Yes, standard for a top-5 pure-play
Automotive Production Volume: Yes
IATF 16949: Yes (verify per fab)
ISO 13485 (Medical): Not a primary focus — verify
ISO 9001: Yes
AS9100 (Aerospace): No
Defense / Rad-Hard Experience: Limited — verify
Export Restriction Status: Not export-restricted (Taiwan/Singapore sites); China site (Suzhou/Hejian) subject to node-agnostic tool controls

Typical Quoted Lead Time (200mm): Historically 12-16 weeks, verify current
Recent Utilization: ~78% (Q3 2025), guided mid-70s% for Q4
Expansion Plans: New Singapore fab targeting 1M wafers/yr, phase 1 from 2026
Geographic Redundancy: Good — Taiwan + Singapore + China
Single-Site Concentration Risk: Moderate — Taiwan remains the largest capacity base
Natural Disaster Exposure: Elevated — Taiwan seismic risk (2024 M7.4 quake briefly halted production)
Utility Risk (Power/Water): Moderate — Taiwan drought/power constraints have affected the industry before

Fab Site	Country	US Import Tariff	Considerations	Risk
Fab 8AB / 8SP — Hsinchu, Tainan	Taiwan	Not recorded	Taiwan Strait tension is the dominant risk; 2024 M7.4 earthquake briefly halted UMC/TSMC production	Elevated
Fab 12i / UMC Suzhou/Hejian	China	Not recorded	Subject to US 'node-agnostic' tool export controls; licensing risk for US-origin equipment	High
UMC Singapore	Singapore	Not recorded	Low friction; used as a China-risk hedge location	Low

MPW Shuttle Availability: Limited direct-to-startup shuttle access; typically via design-service partners/MPW brokers
Typical Mask Set Cost (Order of Magnitude): Mature node: low-to-mid six figures
Prototype/Engineering Wafer Pricing: Not publicly listed
Production Wafer Pricing Direction (2025–26): Stable; ASPs expected to hold firm into Q4 2025 per company guidance
Typical NRE Posture: Volume-oriented; smaller programs typically routed through partners
Packaging/Test Partnerships: Broad OSAT network
Licensing / IP Fees: Standard PDK/TLA licensing

Cadence: Yes
Synopsys: Yes
Siemens EDA (Calibre): Yes
Notable IP Vendor Relationships: Broad third-party IP ecosystem typical of a top-5 pure-play
OSAT / Packaging Partners: Broad OSAT network (verify current list)
Design-Service Partners: Regional design-service houses
University / Reference-Design Programs: Limited public academic program
Open-Source / Academic PDK: No public open PDK