← 200mm Mature-Node
Vanguard (VIS) / VSMC
Hsinchu, Taiwan
Company Overview
- Headquarters
- Hsinchu, Taiwan
- Ownership
- Public (ticker 5347); TSMC remains a significant shareholder but sold ~152M shares (~8.1%) in May 2026, cutting its stake from ~28.3% to ~19%. VSMC is a JV with NXP, owned 60% VIS / 40% NXP
- Total Fabs
- Multiple VIS fabs (Hsinchu, Miaoli, Tainan) + VSMC (Singapore, under construction)
- 200mm Fab Locations
- VIS Hsinchu/Miaoli/Tainan (predominantly 200mm)
- Wafer Sizes Run
- 200mm (VIS) & planned 300mm (VSMC)
- Most Recent Revenue
- FY2025 consolidated revenue NT$48.591B (~US$1.54B, +10.3% YoY); FY2025 operating income NT$9.68B (21% of revenue). FY2024 was NT$44.06B
- Employees
- Not detailed — verify
- Major Segments
- Analog, power management, display driver, discrete
- Long-Term Strategy
- Absorbing mature-node overflow as TSMC/Samsung shrink 200mm; VSMC diversifies geographically to Singapore for NXP automotive supply
Process Technologies
No named process technologies recorded for this foundry yet.
Absence here means the process list has not been researched, not that the foundry offers none.
Technology Portfolio
- CMOS Min/Max Geometry
- 130nm-500nm
- CMOS Analog/RF/Mixed-Signal
- Limited
- CMOS Embedded Memory
- Limited
- CMOS HV, Automotive-Qualified
- Yes
- BCD Voltage Range
- Yes (strong)
- BCD LDMOS
- Yes
- BCD/SOI Isolation Option
- Limited
- SOI — PD-SOI
- No
- SOI — FD-SOI
- No
- SOI — RF-SOI
- Limited
- SOI — Photonics-Compatible
- No
- MEMS
- Limited
- Power — SiC
- Emerging
- Power — GaN
- No
- Power — HV CMOS
- Yes
- Specialty — eNVM
- Yes
- Specialty — CIS
- Limited
- Specialty — Photonics
- No
- Specialty — Display Driver
- Yes (strong)
Manufacturing Capability
- Qualified 200mm Fabs
- 3 (Hsinchu, Miaoli, Tainan) + VSMC (Singapore, building)
- Multi-Site Technology Transfer
- Yes, TSMC-linked technology heritage
- Automotive Production Volume
- Yes, especially via VSMC/NXP
- IATF 16949
- Yes (verify per fab)
- ISO 13485 (Medical)
- Verify
- ISO 9001
- Yes
- AS9100 (Aerospace)
- No
- Defense / Rad-Hard Experience
- None disclosed
- Export Restriction Status
- Not export-restricted; Taiwan Strait geopolitical exposure applies
Capacity & Supply Chain
- Typical Quoted Lead Time (200mm)
- Verify — reported as tightening, beneficiary of TSMC's 200mm retreat
- Recent Utilization
- High (specific % not disclosed)
- Expansion Plans
- VSMC (Singapore) 300mm fab construction ongoing (JV with NXP, groundbreaking 2H2024)
- Geographic Redundancy
- Improving — adding Singapore to Taiwan base via VSMC
- Single-Site Concentration Risk
- Moderate — still majority Taiwan-based
- Natural Disaster Exposure
- Elevated — Taiwan seismic/geopolitical risk
- Utility Risk (Power/Water)
- Moderate — shared Taiwan grid/water exposure with UMC/TSMC
Fabs & Geopolitical Risk
No fab-level geopolitical data listed for this company.
Cost & Commercial
- MPW Shuttle Availability
- Limited direct shuttle access; mostly production-volume customers
- Typical Mask Set Cost (Order of Magnitude)
- Mature node: low-to-mid six figures
- Prototype/Engineering Wafer Pricing
- Not publicly listed
- Production Wafer Pricing Direction (2025–26)
- Rising — direct beneficiary of TSMC/Samsung 200mm capacity cuts
- Typical NRE Posture
- Volume-oriented; VSMC adds a second, NXP-anchored commercial track
- Packaging/Test Partnerships
- Regional Taiwanese/Singaporean OSAT partners
- Licensing / IP Fees
- Standard PDK/TLA licensing
Ecosystem
- Cadence
- Yes
- Synopsys
- Yes
- Siemens EDA (Calibre)
- Yes
- Notable IP Vendor Relationships
- TSMC-adjacent IP ecosystem heritage; NXP's internal IP for VSMC
- OSAT / Packaging Partners
- Regional Taiwanese/Singaporean OSAT
- Design-Service Partners
- Regional design-service houses
- University / Reference-Design Programs
- Limited public academic program
- Open-Source / Academic PDK
- No public open PDK