X-FAB

Erfurt, Germany (holding co. in Tessenderlo, Belgium)

Company Overview

Headquarters: Erfurt, Germany (holding co. in Tessenderlo, Belgium)
Ownership: Public (Euronext Paris: XFAB)
Total Fabs: 6 fabs: Germany (Erfurt, Dresden, Itzehoe), France (Corbeil-Essonnes), Malaysia (Kuching), US (Lubbock, TX)
200mm Fab Locations: All six fabs are 150mm/200mm-class
Wafer Sizes Run: 150mm & 200mm
Most Recent Revenue: ~US$870M FY2025 (up from US$816M FY2024)
Employees: ~4,496 at year-end 2025 (annual report; trackers range 4,433-4,652)
Major Segments: Automotive analog/mixed-signal, MEMS/microsystems, SiC power
Long-Term Strategy: Automotive-grade specialty foundry; deepening Cadence design-migration partnership for multi-node design reuse

No named process technologies recorded for this foundry yet.

Absence here means the process list has not been researched, not that the foundry offers none.

CMOS Min/Max Geometry: 110nm-1um (110nm BCD-on-SOI at Corbeil-Essonnes; Kuching also offers 130/180/350nm)
CMOS Analog/RF/Mixed-Signal: Yes (automotive-grade)
CMOS Embedded Memory: Limited
CMOS HV, Automotive-Qualified: Yes (automotive)
BCD Voltage Range: Yes (automotive-grade)
BCD LDMOS: Yes
BCD/SOI Isolation Option: Yes
SOI — PD-SOI: Limited
SOI — FD-SOI: No
SOI — RF-SOI: Limited
SOI — Photonics-Compatible: No
MEMS: Yes (strong)
Power — SiC: Yes (strong)
Power — GaN: Limited
Power — HV CMOS: Yes
Specialty — eNVM: Yes
Specialty — CIS: No
Specialty — Photonics: Limited
Specialty — Display Driver: No

Qualified 200mm Fabs: 6 (Germany x2, France, Malaysia, US)
Multi-Site Technology Transfer: Yes — explicit design-migration/multi-node reuse program with Cadence
Automotive Production Volume: Yes — core automotive supplier positioning
IATF 16949: Yes — widely cited as IATF 16949 certified across automotive-facing fabs
ISO 13485 (Medical): Verify per fab
ISO 9001: Yes
AS9100 (Aerospace): No
Defense / Rad-Hard Experience: None disclosed
Export Restriction Status: Not export-restricted; EU Chips Act eligible sites

Typical Quoted Lead Time (200mm): Verify — specialty/automotive lead times often longer due to qualification cycles
Recent Utilization: Verify
Expansion Plans: Continuing Cadence-enabled multi-node design-migration investment; no major new-fab announcement in current source set
Geographic Redundancy: Good — Germany x2 + France + Malaysia + US
Single-Site Concentration Risk: Low — most geographically diversified specialty foundry in this list
Natural Disaster Exposure: Low across all sites
Utility Risk (Power/Water): Low — mature grids in Germany/France/US; Malaysia moderate

Fab Site	Country	US Import Tariff	Considerations	Risk
Corbeil-Essonnes	France (EU)	Not recorded	Same low-risk EU profile	Low
Sarawak — Kuching	Malaysia	Not recorded	Neutral, US-aligned Southeast Asian hub; diversification away from China/Taiwan	Low
Lubbock, TX	United States	Not recorded	Low export-control friction	Low
Erfurt, Dresden & Itzehoe	Germany (EU)	Not recorded	EU Chips Act eligible; German automotive customer base ties it to EU industrial policy	Low

MPW Shuttle Availability: Yes — MPW shuttle runs are a core part of X-FAB's automotive/industrial customer engagement model
Typical Mask Set Cost (Order of Magnitude): Automotive analog/SiC: mid six figures, higher for SiC
Prototype/Engineering Wafer Pricing: Not publicly listed
Production Wafer Pricing Direction (2025–26): Verify — no explicit 2025-26 pricing direction in current source set
Typical NRE Posture: Known in the industry for engaging smaller/specialty customers more readily than large digital foundries
Packaging/Test Partnerships: European and Asian OSAT partnerships; verify current list
Licensing / IP Fees: Standard PDK/TLA licensing

Cadence: Yes — deep, recently expanded partnership specifically for automated cross-node design migration
Synopsys: Yes
Siemens EDA (Calibre): Yes — Calibre sign-off standard
Notable IP Vendor Relationships: Automotive-qualified analog/MEMS/SiC IP ecosystem
OSAT / Packaging Partners: European and Asian OSAT partnerships
Design-Service Partners: Strong automotive/industrial design-service network given automotive-qualification focus
University / Reference-Design Programs: Active exhibitor/participant at ICCAD, electronica, ICSCRM — verify formal academic programs
Open-Source / Academic PDK: No public open PDK